Mechanical Design
Enclosure and mechanism design from concept through injection molding. Backed by thermal and structural FEA, rapid prototyping, and hands-on DFM iteration with overseas tooling partners.
Mechanical, electrical, and firmware development under one roof.
Fewer handoffs, faster iterations, and a clear path from concept to production.
Enclosure and mechanism design from concept through injection molding. Backed by thermal and structural FEA, rapid prototyping, and hands-on DFM iteration with overseas tooling partners.
Mixed-signal PCB design from low-level analog sensing through 480 VAC power monitoring. Isolated measurement, disciplined grounding, and power integrity for harsh-environment deployment.
Firmware on STM32, Nordic, and Raspberry Pi platforms, written with full hardware context from board bring-up through production. Cellular IoT, RTOS, and secure boot.
Hardware-in-the-loop test systems, precision data logging, and real-time dashboards. Closing the loop between validation data and design decisions to de-risk production and improve first-pass yield.
Whether you need targeted board bring-up support or end-to-end product development, I'm available to discuss scope.
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